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  an important notice at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. production data. opa4277-sp sbos771a ? december 2016 ? revised january 2019 opa4277-sp radiation hardened high-precision operational amplifier 1 1 features 1 ? qmlv qualified: 5962-16209 ? radiation hardness assurance (rha) up to total ionizing dose (tid) 50 krad(si) ? eldrs-free (see radiation report ) ? single event latchup (sel) immune to let = 85 mev-cm 2 /mg ? ultra-low offset voltage: 20 v ? ultra-low drift: 0.15 v/ c ? high open-loop gain: 134 db ? high common-mode rejection: 140 db ? high-power supply rejection: 130 db ? wide supply range: 2 to 18 v ? low-quiescent current: 800 a/amplifier ? available in 14-lead cfp with industry standard quad operational amplifier pinout 2 applications ? space satellite temperature and position sensing ? high-accuracy space instrumentation ? space precision and scientific applications ? transducer amplifier ? bridge amplifier ? strain gage amplifier ? precision integrator 3 description the opa4277-sp precision operational amplifier replaces the industry standard lm124-sp. it offers improved noise and two orders of magnitude lower input offset voltage. features include ultra-low offset voltage and drift, low-bias current, high common- mode rejection, and high-power supply rejection. the opa4277-sp operates from 2- to 18-v supplies with excellent performance. unlike most operational amplifiers which are specified at only one supply voltage, the opa4277-sp precision operational amplifier is specified for real-world applications; a single limit applies over the 5- to 15- v supply range. high performance is maintained as the amplifier swings to the specified limits. the opa4277-sp is easy to use and free from phase inversion and overload problems found in some operational amplifiers. it is stable in unity gain and provides excellent dynamic behavior over a wide range of load conditions. the opa4277-sp features completely independent circuitry for lowest crosstalk and freedom from interaction, even when overdriven or overloaded. device information (1) part number grade package 5962l1620901vyc 50 krad(si) eldrs-free 14-lead cfp (hfr) 5962l1620901vxa 28-lead cdip (jdj) 5962L1620901V9A kgd (2) opa4277hfr/em engineering samples (3) 14-lead cfp (hfr) (1) for all available packages, see the orderable addendum at the end of the data sheet. (2) kgd = known good die. (3) these units are intended for engineering evaluation only. they are processed to a noncompliant flow. these units are not suitable for qualification, production, radiation testing or flight use. parts are not warrantied for performance over the full mil specified temperature range of ? 55 c to 125 c or operating life. simplified schematic productfolder opa4277-sp no bias currentcancellation resistor r 2 r 1 copyright ? 2016, texas instruments incorporated support &community tools & software technical documents ordernow
2 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated table of contents 1 features .................................................................. 1 2 applications ........................................................... 1 3 description ............................................................. 1 4 revision history ..................................................... 2 5 pin configuration and functions ......................... 3 5.1 bare die information ................................................. 5 6 specifications ......................................................... 6 6.1 absolute maximum ratings ...................................... 6 6.2 esd ratings .............................................................. 6 6.3 recommended operating conditions ...................... 6 6.4 thermal information .................................................. 6 6.5 electrical characteristics ........................................... 7 6.6 typical characteristics .............................................. 9 7 detailed description ............................................ 13 7.1 overview ................................................................. 13 7.2 functional block diagram ....................................... 13 7.3 feature description ................................................. 13 7.4 device functional modes ........................................ 14 8 application and implementation ........................ 15 8.1 application information ............................................ 15 8.2 typical application .................................................. 15 9 power supply recommendations ...................... 17 10 layout ................................................................... 17 10.1 layout guidelines ................................................. 17 10.2 layout example .................................................... 18 11 device and documentation support ................. 19 11.1 receiving notification of documentation updates 19 11.2 community resources .......................................... 19 11.3 trademarks ........................................................... 19 11.4 electrostatic discharge caution ............................ 19 11.5 glossary ................................................................ 19 12 mechanical, packaging, and orderable information ........................................................... 20 4 revision history changes from original (december 2016) to revision a page ? changed features section ..................................................................................................................................................... 1 ? added new device packages .................................................................................................................................................. 1 ? updated pin configurations and functions section ............................................................................................................... 3 ? updated recommended operating conditions table ............................................................................................................. 6 ? updated figure 3 .................................................................................................................................................................... 9
3 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 5 pin configuration and functions hfr package 14-pin cfp top view pin functions: cfp pin i/o description no. name 1 out a o output channel a. 2 ? in a i inverting input channel a. 3 +in a i noninverting input channel a. 4 v+ ? positive (highest) power supply. 5 +in b i noninverting input channel b. 6 ? in b i inverting input channel b. 7 out b o output channel b. 8 out c o output channel c. 9 ? in c i inverting input channel c. 10 +in c i noninverting input channel c. 11 v ? ? negative (lowest) power supply. 12 +in d i noninverting input channel d. 13 ? in d i inverting input channel d. 14 out d o output channel d. 1 out a 14 out d 2 Cin a 13 Cin d 3 +in a 12 +in d 4 v+ 11 vC 5 +in b 10 +in c 6 Cin b 9 Cin c 7 out b 8 out c not to scale
4 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated jdj package 28-pin cdip top view nc - no internal connection pin functions: cdip pin i/o description no. name 1, 3, 4, 8, 11, 12, 14, 15, 17, 18, 21, 25, 26, 28 nc ? not connected. 2 out a o output (channel a). 5 ? in a i inverting input (channel a). 6 +in a i noninverting input (channel a). 7 +vs ? positive (highest) power supply. 9 +in b i inverting input (channel b). 10 ? in b i noninverting input (channel b). 13 out b o output (channel b). 16 out c o output (channel c). 19 +in c i inverting input (channel c). 20 ? in c i noninverting input (channel c). 22 ? vs ? negative (lowest) power supply. 23 +in d i inverting input (channel d). 24 ? in d i noninverting input (channel d). 27 out d o output (channel d). 1 nc 28 nc 2 out a 27 out d 3 nc 26 nc 4 nc 25 nc 5 in a 24 in d 6 +in a 23 +in d 7 +vs 22 vs 8 nc 21 nc 9 +in b 20 in c 10 in b 19 +in c 11 nc 18 nc 12 nc 17 nc 13 out b 16 out c 14 nc 15 nc not to scale
5 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 5.1 bare die information die thickness backside finish backside potential bond pad metallization composition bond pad thickness 15 mils silicon with backgrind negative (lower) power supply alcu (0.5%) 990 to 1210 nm (1) substrate must be biased to v ? , negative (lower) power supply. bond pad coordinates in microns (1) pad i/o description x min y min x max y max no. name 1 out a o output channel a. 1791.042 7290.340 1901.751 7401.049 2 ? in a i inverting input channel a. 1701.719 6111.536 1807.397 6217.213 3 +in a i noninverting input channel a. 1701.719 5326.505 1812.429 5437.215 4 v+ ? positive (higher) power supply. 1555.784 4390.507 1661.461 4498.700 5 +in b i noninverting input channel b. 1706.752 3462.057 1807.397 3562.702 6 ? in b i inverting input channel b. 1701.719 2671.994 1807.397 2777.671 7 out b o output channel b. 1796.074 1498.222 1896.719 1598.867 8 out c o output channel c. 3278.071 1498.222 3383.748 1603.900 9 ? in c i inverting input channel c. 3362.361 2671.994 3473.071 2782.704 10 +in c i noninverting input channel c. 3367.393 3462.057 3473.071 3567.734 11 v ? ? negative (lower) power supply. 3407.651 4391.765 3513.329 4497.442 12 +in d i noninverting input channel d. 3367.393 5331.537 3468.038 5432.182 13 ? in d i inverting input channel d. 3362.361 6111.536 3468.038 6217.213 14 out d o output channel d. 3273.039 7290.340 3383.748 7401.049
6 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions . exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 specifications 6.1 absolute maximum ratings over operating free-air temperature (unless otherwise noted) (1) min max unit supply voltage = (v+) ? (v ? ) 36 v input voltage (v ? ) ? 0.7 (v+) + 0.7 v output short circuit continuous operating temperature ? 55 125 c junction temperature 150 c lead temperature (soldering, 10 s) 300 c storage temperature, t stg ? 55 125 c (1) jedec document jep155 states that 500-v hbm allows safe manufacturing with a standard esd control process. 6.2 esd ratings value unit v (esd) electrostatic discharge human body model (hbm), per ansi/esda/jedec js-001, all pins (1) 2000 v machine model (mm) 100 6.3 recommended operating conditions over operating free-air temperature range (unless otherwise noted) min max unit dual supply voltage 2 18 v tested supply voltage 5 15 v t j operating junction temperature ? 55 125 c (1) for more information about traditional and new thermal metrics, see the ic package thermal metrics application report, spra953 . 6.4 thermal information thermal metric (1) opa4277-sp unit cdip (jdj) 28 pins r ja junction-to-ambient thermal resistance 66.3 c/w r jc(top) junction-to-case (top) thermal resistance 19.3 c/w r jb junction-to-board thermal resistance 26.8 c/w jt junction-to-top characterization parameter 2.1 c/w jb junction-to-board characterization parameter 26.2 c/w
7 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 6.5 electrical characteristics at t j = 25 c, v s = 5 v to 15 v, and r l = 2 k (unless otherwise noted) parameter test conditions min typ max unit offset voltage v os input offset voltage t j = 25 c, pre- and post-irradiated 20 65 v t j = ? 55 c to 125 c, pre-irradiated 140 dv os /d t input offset voltage temperature drift t j = ? 55 c to 125 c, pre-irradiated 0.15 v/ c psrr input offset voltage vs time 0.2 v/mo vs power supply, v s = 2 v to 18 v, t j = 25 c, pre- and post-irradiated 0.3 1 v/v v s = 2 v to 18 v, t j = ? 55 c to 125 c 1 channel separation dc 0.1 v/v input bias current i b input bias current t j = ? 55 c to 125 c 17.5 na t j = 25 c, pre- and post-irradiated 17.5 i os input offset current t j = ? 55 c to 125 c 17.5 na t j = 25 c, pre- and post-irradiated 17.5 noise input voltage noise ? = 0.1 to 10 hz 0.22 v pp input voltage noise density ? = 10 hz 12 nv/ hz ? = 100 hz 8 ? = 1 khz 8 ? = 10 khz 8 i n input noise current density ? = 1 khz 0.2 fa/ hz input voltage v cm common-mode voltage range t j = 25 c, pre- and post-irradiated (v ? ) + 2 (v+) ? 2 v cmrr common-mode rejection ratio (v ? ) + 2 v < v cm < (v+) ? 2 v, t j = 25 c, post-irradiated 114 140 db (v ? ) + 2 v < v cm < (v+) ? 2 v, t j = ? 55 c to 125 c 114 input impedance differential 100 || 3 m || pf common mode (v ? ) + 2 v < v cm < (v+) ? 2 v 250 || 3 g || pf open-loop gain a ol open-loop voltage gain v o = (v o ? ) + 0.5 v to (v o +) ? 1.2 v, r l = 10 k 140 db v o = (v o ? ) + 1.5 v to (v o +) ? 1.5 v, r l = 2 k , t j = ? 55 c to 125 c 118 134 v o = (v o ? ) + 1.5 v to (v o +) ? 1.5 v, r l = 2 k , t j = 25 c, pre- and post-irradiated 118 134 v o = (v o ? ) + 3.4 v to (v o +) ? 3.4 v, r l = 600 , v s = 7 v, t j = ? 55 c to 125 c 118 134 v o = (v o ? ) + 3.4 v to (v o +) ? 3.4 v, r l = 600 , v s = 7 v, t j = 25 c, pre- and post-irradiated 118 134
8 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated electrical characteristics (continued) at t j = 25 c, v s = 5 v to 15 v, and r l = 2 k (unless otherwise noted) parameter test conditions min typ max unit frequency response gbw gain-bandwidth product 1 mhz sr slew rate 0.8 v/ s settling time 0.1%, 10-v step, v s = 15 v, g = 1 14 s 0.01%, 10-v step, v s = 15 v, g = 1 16 thd + n total harmonic distortion + noise 1 khz, g = 1, v o = 3.5 vrms 0.002% output v o output voltage r l = 10 k , t j = 25 c, pre- and post-irradiated (v ? ) + 0.5 (v+) ? 1.2 v r l = 10 k , t j = ? 55 c to 125 c (v ? ) + 0.5 (v+) ? 1.2 r l = 2 k , t j = 25 c, pre- and post-irradiated (v ? ) + 1.5 (v+) ? 1.5 r l = 2 k , t j = ? 55 c to 125 c (v ? ) + 1.5 (v+) ? 1.5 t j = 25 c, r l = 600 , pre- and post-irradiated (v ? ) + 3.4 (v+) ? 3.4 r l = 600 , v s = 7 v, t j = ? 55 c to 125 c (v ? ) + 3.4 (v+) ? 3.4 i sc short-circuit current 35 ma c load capacitive load drive ? = 350 khz, i o = 0 see typical characteristics power supply v s specified voltage t j = ? 55 c to 125 c 5 7 15 v t j = 25 c, pre- and post-irradiated 5 7 15 v s operating voltage t j = ? 55 c to 125 c 2 7 18 v t j = 25 c, pre- and post-irradiated 2 7 18 i q quiescent current per amplifier i o = 0, t j = 25 c, pre- and post-irradiated 790 850 a i o = 0, t j = ? 55 c to 125 c 900
9 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 6.6 typical characteristics at t j = 25 c, v s = 15 v, and r l = 2 k , pre-irradiated (unless otherwise noted). figure 1. open-loop gain/phase vs frequency figure 2. power supply and common-mode rejection vs frequency figure 3. input noise and current noise spectral density vs frequency noise signal is bandwidth limited to lie between 0.1 hz and 10 hz. figure 4. input noise voltage vs time g = 1, measured channel a to d or b to c. other combinations yield similar or improved rejection. figure 5. channel separation vs frequency v out = 3.5 vrms figure 6. total harmonic distortion + noise vs frequency 0.1 1 10 100 1k 10k 100k 1m 10m 140 120 100 80 60 40 20 0 C20 a ol (db) 0 C30 C60 C90 C120 C150 C180 phase () frequency (hz) g c l = 0 c l = 1500 pf 0.1 1 10 100 1k 10k 100k 1m 140 120 100 80 60 40 20 0 psr, cmr (db) frequency (hz) +psr cmr Cpsr 0.1 1000 100 10 1 voltage noise (nv/ hz) current noise (fa/ hz) frequency (hz) input noise and current noise spectral density vs frequency current noise voltage noise 1 10 100 1k 1 s/div 50 nv/div 10 100 1k 10k 100k 1 0.1 0.01 0.001 thd+noise (%) frequency (hz) g = 10, r l = 2 k, 10 k g = 1, r l = 2 k, 10 k 10 100 1k 10k 100k frequency (hz) 1m 140 120 100 80 60 40 channel separation (db)
10 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated typical characteristics (continued) at t j = 25 c, v s = 15 v, and r l = 2 k , pre-irradiated (unless otherwise noted). figure 7. a ol , cmr, psr vs temperature curves represent typical production units. figure 8. input bias current vs temperature figure 9. quiescent current and short-circuit current vs temperature curve shows normalized change in bias current with respect to v s = 10 v (+20 v). typical i b may range from ? 0.5 na to 0.5 na at v s = 10 v. figure 10. change in input bias current vs power supply voltage curve shows normalized change in bias current with respect to v cm = 0 v. typical i b may range from ? 0.5 na to 0.5 na at v cm = 0 v. figure 11. change in input bias current vs common-mode voltage per amplifier figure 12. quiescent current vs supply voltage 15 common-mode voltage (v) C15 C10 C5 0 5 10 2.01.5 1.0 0.5 0.0 C0.5 C1.0 C1.5 C2.0 ? i b (na) v s = 5 v v s = 15 v 1000 900 800 700 600 500 quiescent current (a) 0 5 10 15 20 supply voltage (v) 125 temperature ( c) C75 C50 C25 0 25 50 75 100 54 3 2 1 0 C1 C2 C3 C4 C5 input bias current (na) C75 C50 C25 0 25 50 75 100 125 160 150 140 130 120 110 100 a ol , cmr, psr (db) temperature ( c) cmr a ol psr 40 supply voltage (v) 0 5 10 15 20 25 30 35 2.01.5 1.0 0.5 0.0 C0.5 C1.0 C1.5 C2.0 ? i b (na) v cm = 0 v C75 C50 C25 0 25 50 75 100 125 1000 950900 850 800 750 700 650 600 550 500 quiescent current (a) 10090 80 70 60 50 40 30 20 10 0 short-circuit current (ma) temperature (c) +i sc Ci sc i q
11 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated typical characteristics (continued) at t j = 25 c, v s = 15 v, and r l = 2 k , pre-irradiated (unless otherwise noted). 10-v step c l = 1500 pf figure 13. settling time vs closed-loop gain figure 14. maximum output voltage vs frequency figure 15. output voltage swing vs output current figure 16. small-signal overshoot vs load capacitance g = 1 c l = 1500 pf v s = 15 v figure 17. large-signal step response g = 1 c l = 0 pf v s = 15 v figure 18. small-signal step response (v+) (v+) C 1 (v+) C 2 (v+) C 3 (v+) C 4 (v+) C 5 (vC) + 5 (vC) + 4 (vC) + 3 (vC) + 2 (vC) + 1 (vC) 0 5 10 15 20 25 30 output current (ma) output voltage swing (v) C55c C55c 125c 25c 125c 25c 10 s/div 2 v/div 1 s/div 20 mv/div 100 10 20 50 settling time (s) 1 10 100 gain (v/v) 0.01% 0.1% 1k 100 10 10k 100k load capacitance (pf) 60 50 40 30 20 10 0 overshoot (%) gain = C1 gain = +1 gain = 10 1m frequency (hz) 1k 10k 100k 30 25 20 15 10 50 output voltage (v pp ) v s = 15 v v s = 5 v
12 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated typical characteristics (continued) at t j = 25 c, v s = 15 v, and r l = 2 k , pre-irradiated (unless otherwise noted). g = 1 c l = 1500 pf v s = 15 v figure 19. small-signal step response 1 s/div 20 mv/div
13 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 7 detailed description 7.1 overview the opa4277-sp precision operational amplifier replaces the industry standard lm124-sp. it offers improved noise, wider output voltage swing, and is twice as fast with half the quiescent current. features include ultra-low offset voltage and drift, low bias current, high common-mode rejection, and high power supply rejection. 7.2 functional block diagram 7.3 feature description the opa4277-sp operates from 2- to 18-v supplies with excellent performance. unlike most operational amplifiers which are specified at only one supply voltage, the opa4277-sp precision operational amplifier is specified for real-world applications; a single limit applies over the 5- to 15-v supply range. high performance is maintained as the amplifier swings to the specified limits. because the initial offset voltage ( 50- v max) is so low, user adjustment is usually not required. 7.3.1 input protection the inputs of the opa4277-sp are protected with 1-k series input resistors and diode clamps. the inputs can withstand 30-v differential inputs without damage. the protection diodes conduct current when the inputs are overdriven. this may disturb the slewing behavior of unity-gain follower applications, but will not damage the operational amplifier. figure 20. opa4277-sp input protection 7.3.2 input bias current cancellation the input stage base current of the opa4277-sp is internally compensated with an equal and opposite cancellation circuit. the resulting input bias current is the difference between the input stage base current and the cancellation current. this residual input bias current can be positive or negative. + 1 k 1 k v in+ v in v supply+ v supply v out + copyright ? 2016, texas instruments incorporated
14 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated feature description (continued) when the bias current is canceled in this manner, the input bias current and input offset current are approximately the same magnitude. as a result, it is not necessary to use a bias current cancellation resistor, as is often done with other operational amplifiers (see figure 21 ). a resistor added to cancel input bias current errors may actually increase offset voltage and noise. figure 21. input bias current cancellation 7.4 device functional modes the opa4277-sp has a single functional mode and is operational when the power-supply voltage, (v+) ? (v ? ), is less than 36 v. op amp (a) opa4277-sp (b) no bias currentcancellation resistor (see text) conventional op amp with external bias current cancellation resistor. opa4277-sp with no external bias current cancellation resistor. r 2 r 1 r 2 r 1 r b = r 2 || r 1 copyright ? 2016, texas instruments incorporated
15 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 8 application and implementation note information in the following applications sections is not part of the ti component specification, and ti does not warrant its accuracy or completeness. ti ? s customers are responsible for determining suitability of components for their purposes. customers should validate and test their design implementation to confirm system functionality. 8.1 application information the opa4277-sp is unity-gain stable and free from unexpected output phase reversal, making it easy to use in a wide range of applications. applications with noisy or high-impedance power supplies may require decoupling capacitors close to the device pins. in most cases, 0.1- f capacitors are adequate. 8.2 typical application figure 22. thermocouple low-offset, low-drift loop measurement with diode cold junction compensation 8.2.1 design requirements for the thermocouple low-offset, low-drift loop measurement with diode cold junction compensation shown in figure 22 , a gain of 50 is desired. 14 1 12 5 v 11 13 i reg 1 ma 43 2 6 r g 1250 xtr105 1/4 opa4277-sp 7 r g r g v in C v in + v reg i r2 v+ i ret i o e b 8 i o = 4 ma + (v in C v in ) + C 40 r g 9 10 r f 10 k r 412 1/4 opa4277-sp v+ vC type j 25 (g = 1 + = 50) 2r f r 50 1 k r f 10 k i r1 v lin r cm = 1250 0.01 f copyright ? 2016, texas instruments incorporated
16 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated typical application (continued) 8.2.2 detailed design procedure equation 1 shows the equation used to determine the resistor values needed for a gain of 50. table 1 lists the design parameters. (1) table 1. design parameters design parameter example value r f 10 k r 412 8.2.3 application curve at t j = 25 c, v s = 15 v, and r l = 2 k , unless otherwise noted. typical distribution of packaged units. single, dual, and quad included. figure 23. warm-up offset voltage drift percent of amplifiers (%) offset voltage (v/c) 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 3530 25 20 15 10 50 f 2r g 1 50 r 
17 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 9 power supply recommendations opa4277-sp operates from 2- to 18-v supplies with excellent performance. unlike most operational amplifiers which are specified at only one supply voltage, the opa4277-sp is specified for real-world applications; a single limit applies over the 5- to 15-v supply range. this allows a customer operating at v s = 10 v to have the same assured performance as a customer using 15-v supplies. in addition, key parameters are assured over the specified temperature range, ? 55 c to 125 c. most behavior remains unchanged through the full operating voltage range ( 2 to 18 v). parameters which vary significantly with operating voltage or temperature are shown in the typical performance curves. 10 layout 10.1 layout guidelines the leadframe die pad should be soldered to a thermal pad on the pcb. mechanical drawings located in mechanical, packaging, and orderable information show the physical dimensions for the package and pad. soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. even with applications that have low-power dissipation, the exposed pad must be soldered to the pcb to provide structural integrity and long-term reliability. the opa4277-sp has very-low offset voltage and drift. to achieve highest performance, optimize circuit layout and mechanical conditions. offset voltage and drift can be degraded by small thermoelectric potentials at the operational amplifier inputs. connections of dissimilar metals generate thermal potential, which can degrade the ultimate performance of the opa4277-sp. cancel these thermal potentials by assuring that they are equal in both input terminals. ? keep the thermal mass of the connections made to the two input terminals similar. ? locate heat sources as far as possible from the critical input circuitry. ? shield operational amplifier and input circuitry from air currents such as cooling fans.
18 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 10.2 layout example figure 24. board layout example
19 opa4277-sp www.ti.com sbos771a ? december 2016 ? revised january 2019 product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 11 device and documentation support 11.1 receiving notification of documentation updates to receive notification of documentation updates, navigate to the device product folder on ti.com. in the upper right corner, click on alert me to register and receive a weekly digest of any product information that has changed. for change details, review the revision history included in any revised document. 11.2 community resources the following links connect to ti community resources. linked contents are provided "as is" by the respective contributors. they do not constitute ti specifications and do not necessarily reflect ti's views; see ti's terms of use . ti e2e ? online community ti's engineer-to-engineer (e2e) community. created to foster collaboration among engineers. at e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. design support ti's design support quickly find helpful e2e forums along with design support tools and contact information for technical support. 11.3 trademarks e2e is a trademark of texas instruments. all other trademarks are the property of their respective owners. 11.4 electrostatic discharge caution these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. 11.5 glossary slyz022 ? ti glossary . this glossary lists and explains terms, acronyms, and definitions.
20 opa4277-sp sbos771a ? december 2016 ? revised january 2019 www.ti.com product folder links: opa4277-sp submit documentation feedback copyright ? 2016 ? 2019, texas instruments incorporated 12 mechanical, packaging, and orderable information the following pages include mechanical, packaging, and orderable information. this information is the most current data available for the designated devices. this data is subject to change without notice and revision of this document. for browser-based versions of this data sheet, refer to the left-hand navigation.
package option addendum www.ti.com 26-jan-2019 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish (6) msl peak temp (3) op temp (c) device marking (4/5) samples 5962L1620901V9A active xcept kgd 0 50 green (rohs & no sb/br) call ti n / a for pkg type -55 to 125 5962l1620901vxa active cdip sb jdj 28 1 tbd call ti n / a for pkg type -55 to 125 5962l1620901vx a opa4277-sp 5962l1620901vyc active cfp hfr 14 1 tbd au n / a for pkg type -55 to 125 5962l1620901vyc opa4277-sp opa4277hfr/em active cfp hfr 14 1 tbd au n / a for pkg type 25 to 25 opa4277hfr/em eval only (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) rohs: ti defines "rohs" to mean semiconductor products that are compliant with the current eu rohs requirements for all 10 rohs substances, including the requirement that rohs substance do not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, "rohs" products are suitable for use in specified lead-free processes. ti may reference these types of products as "pb-free". rohs exempt: ti defines "rohs exempt" to mean products that contain lead but are compliant with eu rohs pursuant to a specific eu rohs exemption. green: ti defines "green" to mean the content of chlorine (cl) and bromine (br) based flame retardants meet js709b low halogen requirements of <=1000ppm threshold. antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) msl, peak temp. - the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. (4) there may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) multiple device markings will be inside parentheses. only one device marking contained in parentheses and separated by a "~" will appear on a device. if a line is indented then it is a continuation of the previous line and the two combined represent the entire device marking for that device. (6) lead/ball finish - orderable devices may have multiple material finish options. finish options are separated by a vertical ruled line. lead/ball finish values may wrap to two lines if the finish value exceeds the maximum column width. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and
package option addendum www.ti.com 26-jan-2019 addendum-page 2 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of opa4277-sp : ? catalog: opa4277 ? enhanced product: opa4277-ep note: qualified version definitions: ? catalog - ti's standard catalog product ? enhanced product - supports defense, aerospace and medical applications

www.ti.com package outline c a 7.85 7.35 b 10.724 10.224 25 max 6x 1.27 2x 7.62 8x 0.482 0.382 2.209 max 0.20 0.12 0.43 max (5.498) (7.09) (9.58) 4x (r0.51) 4224229/a 03/2018 cfp - 2.209 mm max height hfr0014a ceramic flatpack notes: 1. all linear dimensions are in millimeters. any dimensions in parenthesis are for reference only. dimensioning and tolerancing per asme y14.5m. 2. this drawing is subject to change without notice. 3. this package is hermetically sealed with a metal lid. the lid is not connected to any lead. 4. the leads are gold plated. 0.2 c a b 1 7 8 14 scale 1.000 1 7 8 14 pin 1 id
important notice and disclaimer ti provides technical and reliability data (including datasheets), design resources (including reference designs), application or other design advice, web tools, safety information, and other resources ?as is? and with all faults, and disclaims all warranties, express and implied, including without limitation any implied warranties of merchantability, fitness for a particular purpose or non-infringement of third party intellectual property rights. these resources are intended for skilled developers designing with ti products. you are solely responsible for (1) selecting the appropriate ti products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. these resources are subject to change without notice. ti grants you permission to use these resources only for development of an application that uses the ti products described in the resource. other reproduction and display of these resources is prohibited. no license is granted to any other ti intellectual property right or to any third party intellectual property right. ti disclaims responsibility for, and you will fully indemnify ti and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. ti?s products are provided subject to ti?s terms of sale ( www.ti.com/legal/termsofsale.html ) or other applicable terms available either on ti.com or provided in conjunction with such ti products. ti?s provision of these resources does not expand or otherwise alter ti?s applicable warranties or warranty disclaimers for ti products. mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2019, texas instruments incorporated


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